beam lead pin diodes for phased arrays and switches technical data hpnd-4028 HPND-4038 features ? low capacitance 0.025 pf maximum at 1 mhz guaranteed min./max. ? fast switching 2.0 nsec ? low resistance at low bias 1.5 w at i f = 10 ma (typical) ? rugged construction typical 10 gram lead pull ? silicon nitride passivation description the hpnd-4028 and 4038 beam lead pin diodes are designed for low capacitance, low resistance, and fast switching at microwave frequencies. these characteristics are achieved at low bias levels for minimal power consumption. advanced processing techniques ensure uniform and consistent electrical performance, allowing guaranteed capacitance windows. this translates to improved performance in phased array applications. rugged construction and strong beams ensure high assembly yields while nitride passivation and polyimide coating ensure reliability. maximum ratings operating temperature ....................................................... -65 c to +150 c storage temperature ........................................................... -65 c to +200 c power dissipation at t case = 25 c ................................................. 250 mw (derate linearly to zero at 150 c.) minimum lead strength ................................... 4 grams pull on either lead per mil-s-19500, ltpd = 20 applications these beam lead pin diodes are designed for use in stripline, coplanar waveguide, or micro- strip circuits. applications include phase shifting and switching. the guaranteed capacitance windows ensure uniform performance in phased outline 83 array radar. the low capacitance makes them ideal for circuits requiring high isolation in the series configuration. these devices have been fully charac- terized and s-parameters have been provided. 280 (11) 240 (9) 110 (4.5) 90 (3.5) 60 (2.4) 40 (1.6) 12 (0.47) 8 (0.32) dimensions in m (1/1000 inch) 690 (27) 650 (26) 330 (13) 260 (10) 220 (9) 180 (7) 180 (7) 160 (6)
2 electrical specifications at t a = 25 c break- series down reverse forward carrier reverse series capacitance resistance voltage current voltage lifetime recovery resistance part (pf) r s ( w )v br (v) i r (na) v f (v) t (ns) t rr (ns) r s ( w ) number hpnd- min. max. typ. max. min. max. max. typ. typ. typ. 4028 0.025 0.045 2.3 3.0 60 100 1.1 36 2.6 2.0 4038 0.045 0.065 1.5 2.0 60 100 1.1 45 2.4 1.0 test v r = 30 v i f = 10 ma v r = v br v r = 50 v i f = 20 ma i f = 10 ma *i f = 10 ma i f = 50 ma conditions f = 1 mhz f = 100 mhz measure i r = 6 ma i f = 5 ma f = 100 mhz i r 10 ma v r = 10 v 90% recovery typical parameters frequency (ghz) figure 1. typical isolation and insertion loss, hpnd-4028. isolation (db) frequency (ghz) figure 2. typical isolation and insertion loss, HPND-4038. isolation (db) insertion loss (db) ?0v 0v 1 ma 5 ma 10 ma 0.12 0.06 0.08 0.10 0.04 0.02 0 0102030 capacitance (pf) reverse voltage (v) figure 3. typical capacitance vs. reverse voltage (at 1 mhz). 40 15 20 25 30 35 10 5 0 0 0.15 0.30 0.45 0.60 0.75 1101820 ?0v 0v 1 ma 5 ma 10 ma 30 10 14 18 22 26 6 2 1 10 20 100 insertion loss (db) 0 0.1 0.2 0.3 0.4 0.5 hpnd-4028 HPND-4038 12 6 8 10 4 2 0 0 5 10 15 reverse recovery time (nsec) forward current (ma) figure 4. typical reverse recovery time vs. forward current (series configuration). hpnd-4028, hpnd- 4038. v n = 10 v v n = 20v figure 5. typical forward characteristics. forward voltage (v) 100 10 1 0.1 0.01 0.001 forward current (ma) 0 0.2 0.4 0.6 0.8 1.0 i f ?forward bias current (ma) figure 6. typical rf resistance vs. forward bias current (at 100 mhz). 1000 100 10 1.0 0.1 rf resistance (ohms) 0.01 0.10 1.0 10 100 HPND-4038 hpnd-4028
3 typical s-parameters (in series configuration) at z o = 50 w , 25 c hpnd-4028 i f = 1 ma i f = 5 ma i f = 10 ma freq. s 11 /s 22 s 21 /s 12 s 11 /s 22 s 21 /s 12 s 11 /s 22 s 21 /s 12 (mhz) mag. ang. db mag. ang. mag. ang. db mag. ang. mag. ang. db mag. ang. 1000 0.046 7 -0.38 0.958 -1 0.031 17 -0.24 0.973 -1 0.027 19 -0.20 0.978 -1 2000 0.048 20 -0.40 0.956 -2 0.036 33 -0.26 0.971 -2 0.033 37 -0.22 0.975 -2 3000 0.052 29 -0.40 0.957 -4 0.041 43 -0.26 0.972 -4 0.040 47 -0.22 0.975 -4 4000 0.058 36 -0.40 0.957 -5 0.049 49 -0.26 0.971 -5 0.047 53 -0.22 0.975 -5 5000 0.063 42 -0.40 0.956 -6 0.057 54 -0.26 0.971 -6 0.055 58 -0.22 0.975 -6 6000 0.069 46 -0.40 0.956 -7 0.064 57 -0.26 0.971 -7 0.063 60 -0.24 0.974 -7 7000 0.075 48 -0.40 0.956 -8 0.070 60 -0.26 0.971 -8 0.070 62 -0.22 0.975 -8 8000 0.081 50 -0.40 0.955 -9 0.077 60 -0.28 0.970 -9 0.076 63 -0.24 0.974 -9 9000 0.087 51 -0.40 0.956 -11 0.084 61 -0.28 0.970 -11 0.083 63 -0.24 0.974 -11 10000 0.092 52 -0.40 0.956 -12 0.089 61 -0.28 0.970 -12 0.089 63 -0.24 0.974 -12 11000 0.097 53 -0.40 0.956 -13 0.095 61 -0.26 0.971 -13 0.095 63 -0.22 0.975 -13 12000 0.103 52 -0.40 0.956 -14 0.101 60 -0.26 0.971 -14 0.101 62 -0.22 0.975 -14 13000 0.107 51 -0.40 0.957 -15 0.106 59 -0.26 0.971 -15 0.105 62 -0.22 0.975 -15 14000 0.112 51 -0.42 0.954 -17 0.110 59 -0.30 0.968 -17 0.111 61 -0.24 0.973 -17 15000 0.119 51 -0.42 0.953 -18 0.117 58 -0.28 0.969 -18 0.117 60 -0.26 0.972 -18 16000 0.123 51 -0.44 0.952 -19 0.122 57 -0.28 0.969 -19 0.123 60 -0.26 0.972 -19 17000 0.129 49 -0.44 0.952 -20 0.130 56 -0.30 0.967 -20 0.129 57 -0.26 0.971 -20 18000 0.139 48 -0.46 0.950 -22 0.139 55 -0.32 0.965 -21 0.140 56 -0.28 0.970 -22 hpnd-4028 v r = 0 v v r = 10 v v r = 30 v freq. s 11 /s 22 s 21 /s 12 s 11 /s 22 s 21 /s 12 s 11 /s 22 s 21 /s 12 (mhz) mag. ang. db mag. ang. mag. ang. db mag. ang. mag. ang. db mag. ang. 1000 0.997 -4 -27.54 0.042 86 0.999 -3 -33.16 0.022 91 1.000 -2 -33.98 0.020 91 2000 0.988 -7 -21.74 0.082 79 0.997 -6 -27.34 0.043 86 0.998 -5 -28.18 0.039 86 3000 0.974 -11 -18.36 0.121 74 0.994 -8 -23.62 0.066 83 0.996 -7 -24.44 0.060 84 4000 0.958 -14 -16.10 0.157 69 0.991 -10 -21.12 0.088 81 0.992 -10 -21.94 0.080 82 5000 0.940 -17 -14.48 0.189 64 0.986 -13 -19.26 0.109 78 0.987 -13 -20.10 0.099 79 6000 0.921 -21 -13.20 0.219 70 0.979 -16 -17.66 0.131 75 0.982 -15 -18.42 0.120 76 7000 0.898 -24 -12.16 0.247 56 0.972 -19 -16.26 0.054 72 0.976 -18 -17.08 0.140 73 8000 0.879 -26 -11.36 0.271 52 0.965 -21 -15.20 0.174 70 0.970 -21 -15.92 0.160 71 9000 0.857 -29 -10.64 0.294 48 0.954 -24 -14.20 0.195 67 0.960 -23 -14.96 0.179 68 10000 0.836 -32 -10.12 0.312 46 0.942 -27 -13.44 0.213 65 0.950 -26 -14.20 0.195 66 11000 0.816 -35 -9.54 0.334 42 0.931 -30 -12.58 0.235 61 0.937 -29 -13.32 0.216 62 12000 0.795 -37 -9.10 0.351 40 0.917 -33 -11.84 0.256 59 0.926 -32 -12.62 0.234 60 13000 0.778 -40 -8.86 0.361 37 0.904 -36 -11.44 0.268 56 0.913 -34 -12.20 0.246 57 14000 0.761 -42 -8.44 0.379 33 0.892 -38 -10.80 0.289 52 0.903 -37 -11.52 0.266 54 15000 0.744 -44 -8.34 0.383 31 0.876 -41 -10.56 0.297 50 0.888 -39 -11.26 0.274 52 16000 0.733 -46 -8.04 0.397 28 0.867 -43 -10.12 0.312 46 0.881 -42 -10.80 0.289 48 17000 0.720 -48 -7.94 0.401 26 0.855 -45 -9.96 0.318 44 0.869 -44 -10.64 0.294 46 18000 0.709 -50 -8.00 0.399 24 0.846 -47 -9.94 0.319 42 0.861 -46 -10.64 0.294 44
4 typical s-parameters (in series configuration) at z o = 50 w , 25 c (cont.) HPND-4038 i f = 1 ma i f = 5 ma i f = 10 ma freq. s 11 /s 22 s 21 /s 12 s 11 /s 22 s 21 /s 12 s 11 /s 22 s 21 /s 12 (mhz) mag. ang. db mag. ang. mag. ang. db mag. ang. mag. ang. db mag. ang. 1000 0.028 15 -0.22 0.976 -1 0.019 28 -0.12 0.987 -1 0.017 35 -0.10 0.989 -1 2000 0.032 34 -0.24 0.974 -2 0.026 50 -0.16 0.984 -2 0.024 56 -0.14 0.986 -2 3000 0.037 47 -0.22 0.975 -3 0.034 61 -0.14 0.985 -3 0.033 66 -0.12 0.988 -4 4000 0.045 55 -0.22 0.975 -5 0.042 67 -0.14 0.985 -5 0.042 70 -0.12 0.987 -5 5000 0.052 61 -0.24 0.974 -6 0.051 72 -0.16 0.984 -6 0.051 75 -0.14 0.986 -6 6000 0.060 65 -0.24 0.974 -7 0.059 74 -0.16 0.984 -7 0.059 77 -0.14 0.986 -7 7000 0.067 67 -0.24 0.974 -8 0.067 76 -0.16 0.984 -8 0.067 78 -0.12 0.987 -8 8000 0.073 69 -0.24 0.974 -9 0.074 76 -0.16 0.983 -9 0.073 78 -0.14 0.986 -9 9000 0.081 70 -0.24 0.973 -10 0.081 77 -0.16 0.984 -10 0.081 78 -0.14 0.986 -10 10000 0.087 71 -0.24 0.974 -11 0.088 77 -0.16 0.982 -11 0.089 79 -0.14 0.986 -11 11000 0.092 71 -0.22 0.975 -12 0.094 77 -0.16 0.984 -12 0.094 79 -0.14 0.986 -12 12000 0.099 70 -0.24 0.974 -14 0.100 76 -0.16 0.984 -14 0.101 77 -0.14 0.986 -14 13000 0.104 70 -0.22 0.975 -15 0.106 75 -0.14 0.985 -15 0.107 76 -0.12 0.987 -15 14000 0.110 69 -0.26 0.972 -16 0.112 74 -0.16 0.982 -16 0.113 75 -0.16 0.984 -16 15000 0.118 67 -0.24 0.973 -17 0.119 72 -0.16 0.983 -17 0.120 73 -0.14 0.985 -17 16000 0.123 66 -0.24 0.973 -18 0.125 71 -0.16 0.982 -18 0.126 72 -0.16 0.984 -18 17000 0.132 64 -0.26 0.972 -19 0.133 68 -0.16 0.982 -19 0.133 69 -0.16 0.984 -19 18000 0.141 62 -0.26 0.972 -20 0.143 66 -0.18 0.980 -20 0.143 67 -0.16 0.983 -20 HPND-4038 v r = 0 v v r = 10 v v r = 30 v freq. s 11 /s 22 s 21 /s 12 s 11 /s 22 s 21 /s 12 s 11 /s 22 s 21 /s 12 (mhz) mag. ang. db mag. ang. mag. ang. db mag. ang. mag. ang. db mag. ang. 1000 0.993 -5 -23.10 0.070 83 0.998 -3 -28.88 0.036 89 0.999 -3 -29.90 0.032 90 2000 0.976 -10 -17.28 0.137 76 0.995 -7 -22.86 0.072 84 0.996 -6 -23.76 0.065 85 3000 0.953 -15 -14.04 0.199 70 0.990 -10 -19.26 0.109 81 0.992 -9 -20.18 0.098 82 4000 0.923 -19 -11.88 0.255 64 0.982 -13 -16.78 0.145 78 0.986 -12 -17.74 0.130 79 5000 0.890 -23 -10.36 0.304 58 0.973 -16 -14.90 0.180 74 0.977 -15 -15.88 0.161 75 6000 0.857 -27 -9.20 0.347 53 0.962 -20 -13.40 0.214 71 0.968 -19 -14.30 0.193 73 7000 0.822 -31 -8.28 0.386 49 0.947 -23 -12.08 0.249 68 0.956 -22 -12.96 0.225 69 8000 0.790 -34 -7.58 0.418 45 0.933 -27 -11.06 0.280 65 0.945 -25 -11.92 0.254 66 9000 0.757 -38 -7.00 0.447 41 0.915 -30 -10.12 0.312 61 0.928 -29 -10.94 0.284 63 10000 0.727 -41 -6.54 0.471 38 0.897 -34 -9.40 0.339 58 0.912 -32 -10.22 0.309 61 11000 0.697 -44 -6.10 0.496 34 0.877 -37 -8.62 0.371 54 0.892 -35 -9.44 0.338 57 12000 0.668 -46 -5.74 0.517 32 0.854 -41 -8.00 0.399 52 0.874 -38 -8.76 0.365 54 13000 0.643 -49 -5.56 0.528 29 0.834 -44 -7.60 0.417 49 0.854 -42 -8.34 0.383 51 14000 0.620 -51 -5.22 0.549 26 0.813 -47 -7.04 0.445 45 0.839 -45 -7.76 0.410 48 15000 0.599 -53 -5.16 0.553 24 0.793 -50 -6.82 0.457 43 0.818 -48 -7.50 0.422 45 16000 0.584 -55 -4.90 0.569 21 0.778 -53 -6.42 0.478 39 0.805 -50 -7.10 0.442 42 17000 0.570 -57 -4.80 0.576 19 0.762 -55 -6.22 0.489 37 0.790 -53 -6.88 0.453 40 18000 0.556 -59 -4.84 0.574 17 0.747 -58 -6.18 0.491 35 0.776 -55 -6.86 0.454 37
5 bonding and handling procedures for beam lead diodes 1. storage under normal circumstances, storage of beam lead diodes in agilent supplied waffle/gel packs is sufficient. in particularly dusty or chemically hazardous environ- ments, storage in an inert atmo- sphere desiccator is advised. 2. handling in order to avoid damage to beam lead devices, particular care must be exercised during inspection, testing, and assembly. although the beam lead diode is designed to have exceptional lead strength, its small size and delicate nature requires that special handling techniques be observed so that the devices will not be mechani- cally or electrically damaged. a vacuum pickup is recommended for picking up beam lead devices, particularly larger ones, e.g., quads. care must be exercised to assure that the vacuum opening of the needle is sufficiently small to avoid passage of the device through the opening. a #27 tip is recommended for picking up single beam lead devices. a 20x magnification is needed for precise positioning of the tip on the device. where a vacuum pickup is not used, a sharpened wooden q-tip dipped in isopropyl alcohol is very commonly used to handle beam lead devices. 3. cleaning for organic contamination use a warm rinse of trichloroethane, or its locally approved equivalent, followed by a cold rinse in ac- etone and methanol. dry under infrared heat lamp for 5C10 minutes on clean filter paper. freon degreaser, or its locally approved equivalent, may replace trichloroethane for light organic contamination. ? ultrasonic cleaning is not recommended. ? acid solvents should not be used. 4. bonding thermocompression: see application note 979 the han- dling and bonding of beam lead devices made easy. this method is good for hard substrates only. wobble: this method picks up the device, places it on the substrate and forms a thermo- compression bond all in one operation. this is described in the latest version of mil-std-883, method 2017, and is intended for hard substrates only. resistance welding or parallel-gap welding: to make welding on soft substrates easier, a low pressure welding head is recommended. suitable equip- ment is available from hughes, industrial products division in carlsbad, ca. epoxy: with solvent free, low resistivity epoxies (available from ablestik and improvements in dispensing equipment, the quality of epoxy bonds is sufficient for many applications. 5. lead stress in the process of bonding a beam lead diode, a certain amount of bugging occurs. the term bugging refers to the chip lifting away from the substrate during the bonding process due to the deformation of the beam by the bonding tool. this effect is beneficial as it provides stress relief for the diode during thermal cycling of the substrate. the coefficient of expansion of some substrate materials, specifically soft substrates, is such that some bugging is essential if the circuit is to be operated over wide tempera- ture extremes. thick metal clad ground planes restrict the thermal expansion of the dielectric substrates in the x-y axis. the expansion of the dielec- tric will then be mainly in the z axis, which does not affect the beam lead device. an alternate solution to the problem of dielec- tric ground plane expansion is to heat the substrate to the maxi- mum required operating tempera- ture during the beam lead attach- ment. thus, the substrate is at maximum expansion when the device is bonded. subsequent cooling of the substrate will cause bugging, similar to bugging in thermocompression bonding or epoxy bonding. other methods of bugging are preforming the leads during assembly or prestressing the substrate. o 5
www.semiconductor.agilent.com data subject to change. copyright ? 1999 agilent technologies obsoletes 5965-8878e 5967-6157e (11/99)
|
